On the last day of CeBIT we visited Intel’s and Verbatim’s booth. Both manufacturers prepared some interesting novelties, each in its domain. Intel, as expected, will launch Westmere in Q4 this year, while Verbatim showcased, among other products, eSATA SSD disks.

 

 

Intel’s development strategy is following its two stroke (tick-tock) rhythm perfectly. Technology is constantly improving, users are using new solutions, faster CPUs and new chipsets. After first stroke with Nehalem architecture, second stroke is scheduled for fourth quarter this year.  New manufacturing technology – Westmere, based on 32nm process, closes Nehalem micro architecture chapter. In high-end segment in 2009, Intel will be focusing on quad core Core i7 and Core i7 Extreme CPUs, while Westmere architecture will provide six core CPUs for high-end segment that has code name Gulfdale while mainstream and mobile platforms will be covered with dual core versions with integrated graphics (InsideHW News: Intel Presented Its New 32nm CPUs). This is exactly what we have seen on Intel 5 series motherboards. There was no northbridge chip because memory controller is present in CPU (Nehalem) and graphics controller (Westmere). Motherboards based on new Intel series 5 chipset (or chip) will have integrated graphics and CPU will communicate with it through new FDI – Flexible Display Interface. Dual core CPUs will have integrated two channel memory controller with support only for DDR3 memory. High-end versions will have 6 cores, integrated graphics and 3 channel memory controller.

The way Intel presented its technologies on this year’s CeBIT was unique. Big touch screen with projector, that provided GUI through interesting interface, presented Intel’s solutions. If you choose Gaming 3D you will be shown big room with big screen and Core i7 CPU in configuration. Mobile showed power saving platforms based on Centrino 2 technology while Home option leads you to networked home full of devices with Intel CPUs. Unique and above all entertaining way to present possibilities and applicability of certain technologies.